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The height of the H3 is 1.18mm while the RAM (k4b4g1646q-hyk0) is 1.10mm +- 10% (depending on the solder balls, I suppose). I'm guessing if the thermal interface material were a tiny bit thicker, the 25x35x10mm heatsink would be ideal. a 35x35mm heatsink would be too close to the GPIO headers so I believe the 25x35x10mm heatsink as mentioned by magicse is the best option we have.
If you have time to modify heatsinks available out there, you can fully cover the h3 and the ram on the Orange Pi PC by cutting a larger heatsink to 28mm (distance from top of one RAM chip to the bottom of the other) x 35mm (distance from the far sides of the RAM chips to the lower left corner of the H3.)
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